专利内容由知识产权出版社提供
专利名称：Flip-chip package structure with direct
electrical connection of semiconductor chip
发明人：Shih-Ping Hsu申请号：US112730申请日：20051114
公开号：US20060157867A1公开日：20060720
专利附图：
摘要：A flip-chip package structure with direct electrical connection of a
semiconductor chip has at least a dielectric layer; the semiconductor chip having electricalconnection pads on an active surface thereof and connecting the dielectric layer via the
active surface; and at least a wiring layer formed on a side of the dielectric layer notconnecting the semiconductor chip, the wiring layer electrically connecting the electricalconnection pads of the semiconductor chip via a plurality of conductive electrodesformed in the dielectric layer. A non-active surface of the semiconductor chip can beexposed, the heat dissipating efficiency can be enhanced, while the overall height of thepackage structure can be decreased.
申请人：Shih-Ping Hsu
地址：Hsin-chu TW
国籍：TW
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