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专利名称：Package guide发明人：軣木 岳史申请号：JP2017251445申请日：20171227公开号：JP2019117125A公开日：20190718
专利附图：
摘要：Provided is a package guide capable of positioning a package regardless of thethickness of the package and without complicating the shape of the end surface of thepressure pad that presses the package in contact with the package. A base portion 11having a package placement surface 11a and a guide member 12 for positioning apackage 60 at a specified position, the guide member 12 being provided so as to bemovable up and down with respect to the base portion 11, and The base portion 11 isbiased in a direction protruding from the package placement surface 11a. [Selectedfigure] Figure 1
申请人：株式会社ヨコオ
地址：東京都北区滝野川７丁目５番１１号
国籍：JP
代理人：村井 隆,村井 弘実
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