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专利名称：Die Bonder
发明人：Yoshiaki MAKITA,Shingo Fukasawa申请号：US13224511申请日：20110902
公开号：US20130016205A1公开日：20130117
专利附图：
摘要：A die bonder that eliminates the need for moving a recognition camera forcapturing an image related to adhesive application and achieves high reliability with highthroughput is disclosed. The die bonder includes a lead frame; a syringe located abovethe lead frame and enclosing therein a paste adhesive; a recognition camera lateral to
the syringe; an illumination lamp disposed in the vicinity of the recognition camera; and areflector plate disposed opposite the illumination lamp. The reflector plate is adapted toreflect light from the illumination lamp onto the lead frame at an application surface ofthe paste adhesive. The recognition camera, illumination lamp, and reflector plate arearranged in a manner that the reflector plate is disposed on −Y side and the recognitioncamera and the illumination lamp are disposed on +Y side with respect to the syringelocated above the lead frame transported in X direction.
申请人：Yoshiaki MAKITA,Shingo Fukasawa
地址：Kumagaya JP,Kumagaya JP
国籍：JP,JP
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