1.0
1.31.2
IV/I V(25C)= f (TA), IF= 20mA
Relative Luminous IntensityRelative Luminuos Intensity1.11.00.90.80.70.6
0.0
400
500600700
0.5-40
-200204060
o
80100
Wavelength [nm]
Ambient Temperature Ta[C]
Wavelength vs. Relative Intensity Ambient Temperature vs. Relative Intensity
<060712> Rev. 0.1LB700D
SEOUL SEMICONDUCTOR CO., LTD.
148-29, Kasan-Dong, Keumchun-Gu, Seoul, KoreaTEL : 82-2-3281-6269 FAX : 82-2-857-5430
-7-
0.5
7. BIN CODE DESCRIPTIONBIN CODEIntensityTColor Ranks1Forward Voltage2Intensity (mcd) @ IF =20mABIN CODESTUMin.300450600Max.450600800Dominant Wavelength (nm) @ IF =20mABIN CODE12Min.4470Max.470476Forward Voltage(V) @ IF =20mABIN CODE01234Min.3.03.23.43.63.8Max.3.23.43.63.84.0<060712> Rev. 0.1LB700DSEOUL SEMICONDUCTOR CO., LTD.148-29, Kasan-Dong, Keumchun-Gu, Seoul, KoreaTEL : 82-2-3281-6269 FAX : 82-2-857-5430-8-8. PACKING1) Bulk Packing (1) Antistatic poly vinyl bag applyPoly bag: 5φLamp Series : 500pcs3φLamp Series : 500pcs(2) Inner box structure70mmLXXXXQTY : pcsLOT : 200X.XX.XX XXXRANK170mmOOO260mmSEOUL SEMICONDUCTOR CO., LTD(3) Outer box structureBox : 27 boxes315.0mm485.0mm<060712> Rev. 0.1LB700DSEOUL SEMICONDUCTOR CO., LTD.148-29, Kasan-Dong, Keumchun-Gu, Seoul, KoreaTEL : 82-2-3281-6269 FAX : 82-2-857-5430-9-97.0mmBox : 2 poly bagsLX0002) Tapping Outline DimensionsP0±1.30±2.0FW1W2WoPoDoHoPackage Dimensions (unit : mm)Ho*WWoW1W218.0 +1.0-0.513.0±0.31.0±0.59.0±0.51 Box contain quantity.∗ 3φLamp Series : 3000pcs* 5φLamp Series : 2000pcsPPoFDo12.7±0.512.7±0.35.0±0.5φ4.0±0.5* Remark : Ho -users define.<060712> Rev. 0.1LB700DSEOUL SEMICONDUCTOR CO., LTD.148-29, Kasan-Dong, Keumchun-Gu, Seoul, KoreaTEL : 82-2-3281-6269 FAX : 82-2-857-5430-10-W3) Forming Outline DimensionsPH1F HoHW1W2WoPoDoPackage Dimensions (unit : mm)H *Ho *H1 *WWoW118.0 +1.0-0.513.0±0.31.0±0.5W2PPoFDo9.0±0.512.7±0.512.7±0.35.0±0.5φ4.0±0.51 Box contain quantity.∗ 3φLamp Series : 2000pcs* 5φLamp Series : 1500pcs* Remark : H / Ho / H1-users define.<060712> Rev. 0.1LB700DSEOUL SEMICONDUCTOR CO., LTD.148-29, Kasan-Dong, Keumchun-Gu, Seoul, KoreaTEL : 82-2-3281-6269 FAX : 82-2-857-5430-11-W 9. SOLDERING PROFILE1) Wave Soldering Conditions / Profile•Preliminary heating to be at 85ºC(120 ºC max)for 20 seconds(60 seconds max).•Soldering heat to be at 235 ºC(260ºCmax) for 5 seconds (10 seconds max.)•Soak time above 200 ºCis 5 seconds 250PEAK2005s (10s Max)235 ºC(260 ºC Max)Temperature [C]150OPREHEAT10020s (30s Max)85 ºC(100 ºC max)500024681012141618202224262830323436Time[s]2) Hand Soldering conditions •Not more than 5 seconds at max. 300ºC, under Soldering iron.Note : In case the soldered products are reused in soldering process, we don’t guarantee the products. <060712> Rev. 0.1LB700DSEOUL SEMICONDUCTOR CO., LTD.148-29, Kasan-Dong, Keumchun-Gu, Seoul, KoreaTEL : 82-2-3281-6269 FAX : 82-2-857-5430-12- 10. PART NUMBERING SYSTEM12345678ABCL*******-***1) Lamp LED initial 2) ColorU: Ultra Violet, B : Blue (460~490nm), C : Cyan (490~510nm) R : Red (620~700nm) I : InfraredT : True Green (510~540nm), G : Yellow-Green (540~580nm)Y : Yellow (580~600nm) O : Orange (600~620nm) W : White 3) If the products have 2 or 3chipsGR : Green + Red ( according to wavelength), FL : Full color 4) Outline type 1 : 3x2(square), 2 : 5x2(square), 3 : Phi3, 6 : 3Phi Oval, 7 : 5Phi Oval5) Half angle1: ~14O, 2: 15~24O, 3: 25~34O, 4: 35~44O, 5 : 45~54O…0 : more than 100O6) 1stDevelopment according to a chip7) 2ndDevelopment (other material)D : diffused C : colored Z : zenerchip attached 8) Stand off type A, B, C : Bin cord description A: IV, B: WD C: VF5 : Phi 5 , M : Warm <060712> Rev. 0.1LB700DSEOUL SEMICONDUCTOR CO., LTD.148-29, Kasan-Dong, Keumchun-Gu, Seoul, KoreaTEL : 82-2-3281-6269 FAX : 82-2-857-5430-13-11. PRECAUTION FOR USE
1)2)3)4)5)6)7)8)9)10)
In order to avoid the absorption of moisture, it is recommended to store in the dry box (or desiccators) with a desiccant .
In case of more than 1 week passed after opening or change colorof indicator on desiccant components shall be dried 10-12Hr, at 60±5℃.
In case of supposed the components is humid, shall be dried dip-solder just before, 12Hr at 80±5℃or 10Hr at 100±5℃.
Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp. after soldering.Quick cooling shall not be avoid.
Components shall not be mounted on warped direction of PCB.
Anti radioactive ray design is not considered for the products listed here in.
This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA should be used.
When theLEDsare illuminating, operating current should be decided after considering the ambient maximum temperature.
LEDsmust be stored to maintain a clean atmosphere. If theLEDsare stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage.
The LEDsmust be soldered within seven days after opening the moisture-proof packing.Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place.
The appearance and specifications of the product may be modifiedfor improvement without notice.
11)12)13)
<060712> Rev. 0.1LB700D
SEOUL SEMICONDUCTOR CO., LTD.
148-29, Kasan-Dong, Keumchun-Gu, Seoul, KoreaTEL : 82-2-3281-6269 FAX : 82-2-857-5430
-14-
因篇幅问题不能全部显示,请点此查看更多更全内容
Copyright © 2019- cepb.cn 版权所有 湘ICP备2022005869号-7
违法及侵权请联系:TEL:199 18 7713 E-MAIL:2724546146@qq.com
本站由北京市万商天勤律师事务所王兴未律师提供法律服务