www.ti.com
18-Sep-2008
PACKAGINGINFORMATION
OrderableDeviceSN54HC4060FKSN74HC4060DSN74HC4060DBRSN74HC4060DBRE4SN74HC4060DBRG4SN74HC4060DE4SN74HC4060DG4SN74HC4060DRSN74HC4060DRE4SN74HC4060DRG4SN74HC4060DTSN74HC4060DTE4SN74HC4060DTG4SN74HC4060NSN74HC4060NE4SN74HC4060NSRSN74HC4060NSRE4SN74HC4060NSRG4SN74HC4060PWSN74HC4060PWE4SN74HC4060PWG4SN74HC4060PWRSN74HC4060PWRE4SN74HC4060PWRG4SN74HC4060PWT
Status(1)ACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVE
PackageTypeLCCCSOICSSOPSSOPSSOPSOICSOICSOICSOICSOICSOICSOICSOICPDIPPDIPSOSOSOTSSOPTSSOPTSSOPTSSOPTSSOPTSSOPTSSOP
PackageDrawingFKDDBDBDBDDDDDDDDNNNSNSNSPWPWPWPWPWPWPW
PinsPackageEcoPlan(2)
Qty20161616161616161616161616161616161616161616161616
140
TBDGreen(RoHS&noSb/Br)
Lead/BallFinish
MSLPeakTemp(3)
POST-PLATEN/AforPkgTypeCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAU
Level-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMN/AforPkgTypeN/AforPkgTypeLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIM
2000Green(RoHS&
noSb/Br)2000Green(RoHS&
noSb/Br)2000Green(RoHS&
noSb/Br)4040
Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)
2500Green(RoHS&
noSb/Br)2500Green(RoHS&
noSb/Br)2500Green(RoHS&
noSb/Br)2502502502525
Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)
Pb-Free(RoHS)Pb-Free(RoHS)
2000Green(RoHS&
noSb/Br)2000Green(RoHS&
noSb/Br)2000Green(RoHS&
noSb/Br)909090
Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)
2000Green(RoHS&
noSb/Br)2000Green(RoHS&
noSb/Br)2000Green(RoHS&
noSb/Br)250
Green(RoHS&noSb/Br)
Addendum-Page1
芯天下--http://oneic.com/
PACKAGEOPTIONADDENDUM
www.ti.com
18-Sep-2008
OrderableDeviceSN74HC4060PWTE4SN74HC4060PWTG4
(1)
Status(1)ACTIVEACTIVE
PackageTypeTSSOPTSSOP
PackageDrawingPWPW
PinsPackageEcoPlan(2)
Qty1616
250250
Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)
Lead/BallFinishCUNIPDAUCUNIPDAU
MSLPeakTemp(3)Level-1-260C-UNLIMLevel-1-260C-UNLIM
Themarketingstatusvaluesaredefinedasfollows:ACTIVE:Productdevicerecommendedfornewdesigns.
LIFEBUY:TIhasannouncedthatthedevicewillbediscontinued,andalifetime-buyperiodisineffect.
NRND:Notrecommendedfornewdesigns.Deviceisinproductiontosupportexistingcustomers,butTIdoesnotrecommendusingthispartinanewdesign.
PREVIEW:Devicehasbeenannouncedbutisnotinproduction.Samplesmayormaynotbeavailable.OBSOLETE:TIhasdiscontinuedtheproductionofthedevice.
(2)
EcoPlan-Theplannedeco-friendlyclassification:Pb-Free(RoHS),Pb-Free(RoHSExempt),orGreen(RoHS&noSb/Br)-pleasecheckhttp://www.ti.com/productcontentforthelatestavailabilityinformationandadditionalproductcontentdetails.TBD:ThePb-Free/Greenconversionplanhasnotbeendefined.
Pb-Free(RoHS):TI'sterms\"Lead-Free\"or\"Pb-Free\"meansemiconductorproductsthatarecompatiblewiththecurrentRoHSrequirementsforall6substances,includingtherequirementthatleadnotexceed0.1%byweightinhomogeneousmaterials.Wheredesignedtobesolderedathightemperatures,TIPb-Freeproductsaresuitableforuseinspecifiedlead-freeprocesses.
Pb-Free(RoHSExempt):ThiscomponenthasaRoHSexemptionforeither1)lead-basedflip-chipsolderbumpsusedbetweenthedieandpackage,or2)lead-baseddieadhesiveusedbetweenthedieandleadframe.ThecomponentisotherwiseconsideredPb-Free(RoHScompatible)asdefinedabove.
Green(RoHS&noSb/Br):TIdefines\"Green\"tomeanPb-Free(RoHScompatible),andfreeofBromine(Br)andAntimony(Sb)basedflameretardants(BrorSbdonotexceed0.1%byweightinhomogeneousmaterial)
(3)
MSL,PeakTemp.--TheMoistureSensitivityLevelratingaccordingtotheJEDECindustrystandardclassifications,andpeaksoldertemperature.
ImportantInformationandDisclaimer:TheinformationprovidedonthispagerepresentsTI'sknowledgeandbeliefasofthedatethatitisprovided.TIbasesitsknowledgeandbeliefoninformationprovidedbythirdparties,andmakesnorepresentationorwarrantyastotheaccuracyofsuchinformation.Effortsareunderwaytobetterintegrateinformationfromthirdparties.TIhastakenandcontinuestotakereasonablestepstoproviderepresentativeandaccurateinformationbutmaynothaveconducteddestructivetestingorchemicalanalysisonincomingmaterialsandchemicals.TIandTIsuppliersconsidercertaininformationtobeproprietary,andthusCASnumbersandotherlimitedinformationmaynotbeavailableforrelease.
InnoeventshallTI'sliabilityarisingoutofsuchinformationexceedthetotalpurchasepriceoftheTIpart(s)atissueinthisdocumentsoldbyTItoCustomeronanannualbasis.
Addendum-Page2
芯天下--http://oneic.com/
PACKAGEMATERIALSINFORMATION
www.ti.com
14-Jul-2012
TAPEANDREELINFORMATION
*Alldimensionsarenominal
Device
PackagePackagePinsTypeDrawingSSOPSOICSOICSOTSSOPTSSOPTSSOPTSSOP
DBDDNSPWPWPWPW
1616161616161616
SPQ
ReelReelA0DiameterWidth(mm)(mm)W1(mm)330.0330.0330.0330.0330.0330.0330.0330.0
16.416.416.416.412.412.412.412.4
8.26.56.58.26.97.06.96.9
B0(mm)6.610.310.310.55.65.65.65.6
K0(mm)2.52.12.12.51.61.61.61.6
P1(mm)12.08.08.012.08.08.08.08.0
WPin1(mm)Quadrant16.016.016.016.012.012.012.012.0
Q1Q1Q1Q1Q1Q1Q1Q1
SN74HC4060DBRSN74HC4060DRSN74HC4060DRSN74HC4060NSRSN74HC4060PWRSN74HC4060PWRSN74HC4060PWRG4SN74HC4060PWT
2000250025002000200020002000250
PackMaterials-Page1
芯天下--http://oneic.com/
PACKAGEMATERIALSINFORMATION
www.ti.com
14-Jul-2012
*Alldimensionsarenominal
DeviceSN74HC4060DBRSN74HC4060DRSN74HC4060DRSN74HC4060NSRSN74HC4060PWRSN74HC4060PWRSN74HC4060PWRG4SN74HC4060PWT
PackageType
SSOPSOICSOICSOTSSOPTSSOPTSSOPTSSOP
PackageDrawing
DBDDNSPWPWPWPW
Pins1616161616161616
SPQ2000250025002000200020002000250
Length(mm)
367.0333.2367.0367.0367.03.0367.0367.0
Width(mm)367.0345.9367.0367.0367.03.0367.0367.0
Height(mm)
38.028.638.038.035.027.035.035.0
PackMaterials-Page2
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芯天下--http://oneic.com/
芯天下--http://oneic.com/
芯天下--http://oneic.com/
芯天下--http://oneic.com/
芯天下--http://oneic.com/
芯天下--http://oneic.com/
芯天下--http://oneic.com/MECHANICAL DATAMSSO002E – JANUARY 1995 – REVISED DECEMBER 2001DB (R-PDSO-G**) 28 PINS SHOWN0,65280,380,22150,15MPLASTIC SMALL-OUTLINE0,250,095,605,008,207,40Gage Plane1A140°–ā8°0,250,950,55Seating Plane2,00 MAX0,05 MIN0,10PINS **DIMA MAX146,50166,50207,50248,502810,503010,503812,90A MIN5,905,906,907,909,909,9012,304040065/E 12/01NOTES:A.B.C.D.All linear dimensions are in millimeters.This drawing is subject to change without notice.Body dimensions do not include mold flash or protrusion not to exceed 0,15.Falls within JEDEC MO-150POST OFFICE BOX 655303 DALLAS, TEXAS 75265•芯天下--http://oneic.com/IMPORTANTNOTICE
TexasInstrumentsIncorporatedanditssubsidiaries(TI)reservetherighttomakecorrections,enhancements,improvementsandotherchangestoitssemiconductorproductsandservicesperJESD46CandtodiscontinueanyproductorserviceperJESD48B.Buyersshouldobtainthelatestrelevantinformationbeforeplacingordersandshouldverifythatsuchinformationiscurrentandcomplete.All
semiconductorproducts(alsoreferredtohereinas“components”)aresoldsubjecttoTI’stermsandconditionsofsalesuppliedatthetimeoforderacknowledgment.
TIwarrantsperformanceofitscomponentstothespecificationsapplicableatthetimeofsale,inaccordancewiththewarrantyinTI’stermsandconditionsofsaleofsemiconductorproducts.TestingandotherqualitycontroltechniquesareusedtotheextentTIdeemsnecessarytosupportthiswarranty.Exceptwheremandatedbyapplicablelaw,testingofallparametersofeachcomponentisnotnecessarilyperformed.
TIassumesnoliabilityforapplicationsassistanceorthedesignofBuyers’products.BuyersareresponsiblefortheirproductsandapplicationsusingTIcomponents.TominimizetherisksassociatedwithBuyers’productsandapplications,Buyersshouldprovideadequatedesignandoperatingsafeguards.
TIdoesnotwarrantorrepresentthatanylicense,eitherexpressorimplied,isgrantedunderanypatentright,copyright,maskworkright,orotherintellectualpropertyrightrelatingtoanycombination,machine,orprocessinwhichTIcomponentsorservicesareused.InformationpublishedbyTIregardingthird-partyproductsorservicesdoesnotconstitutealicensetousesuchproductsorservicesorawarrantyorendorsementthereof.Useofsuchinformationmayrequirealicensefromathirdpartyunderthepatentsorotherintellectualpropertyofthethirdparty,oralicensefromTIunderthepatentsorotherintellectualpropertyofTI.
ReproductionofsignificantportionsofTIinformationinTIdatabooksordatasheetsispermissibleonlyifreproductioniswithoutalterationandisaccompaniedbyallassociatedwarranties,conditions,limitations,andnotices.TIisnotresponsibleorliableforsuchaltereddocumentation.Informationofthirdpartiesmaybesubjecttoadditionalrestrictions.
ResaleofTIcomponentsorserviceswithstatementsdifferentfromorbeyondtheparametersstatedbyTIforthatcomponentorservicevoidsallexpressandanyimpliedwarrantiesfortheassociatedTIcomponentorserviceandisanunfairanddeceptivebusinesspractice.TIisnotresponsibleorliableforanysuchstatements.
Buyeracknowledgesandagreesthatitissolelyresponsibleforcompliancewithalllegal,regulatoryandsafety-relatedrequirements
concerningitsproducts,andanyuseofTIcomponentsinitsapplications,notwithstandinganyapplications-relatedinformationorsupportthatmaybeprovidedbyTI.Buyerrepresentsandagreesthatithasallthenecessaryexpertisetocreateandimplementsafeguardswhichanticipatedangerousconsequencesoffailures,monitorfailuresandtheirconsequences,lessenthelikelihoodoffailuresthatmightcauseharmandtakeappropriateremedialactions.BuyerwillfullyindemnifyTIanditsrepresentativesagainstanydamagesarisingoutoftheuseofanyTIcomponentsinsafety-criticalapplications.
Insomecases,TIcomponentsmaybepromotedspecificallytofacilitatesafety-relatedapplications.Withsuchcomponents,TI’sgoalistohelpenablecustomerstodesignandcreatetheirownend-productsolutionsthatmeetapplicablefunctionalsafetystandardsandrequirements.Nonetheless,suchcomponentsaresubjecttotheseterms.
NoTIcomponentsareauthorizedforuseinFDAClassIII(orsimilarlife-criticalmedicalequipment)unlessauthorizedofficersofthepartieshaveexecutedaspecialagreementspecificallygoverningsuchuse.
OnlythoseTIcomponentswhichTIhasspecificallydesignatedasmilitarygradeor“enhancedplastic”aredesignedandintendedforuseinmilitary/aerospaceapplicationsorenvironments.BuyeracknowledgesandagreesthatanymilitaryoraerospaceuseofTIcomponentswhichhavenotbeensodesignatedissolelyattheBuyer'srisk,andthatBuyerissolelyresponsibleforcompliancewithalllegalandregulatoryrequirementsinconnectionwithsuchuse.
TIhasspecificallydesignatedcertaincomponentswhichmeetISO/TS16949requirements,mainlyforautomotiveuse.Componentswhichhavenotbeensodesignatedareneitherdesignednorintendedforautomotiveuse;andTIwillnotberesponsibleforanyfailureofsuchcomponentstomeetsuchrequirements.ProductsAudioAmplifiersDataConvertersDLP®ProductsDSP
ClocksandTimersInterfaceLogicPowerMgmtMicrocontrollersRFID
OMAPMobileProcessorsWirelessConnectivity
www.ti.com/audioamplifier.ti.comdataconverter.ti.comwww.dlp.comdsp.ti.comwww.ti.com/clocksinterface.ti.comlogic.ti.compower.ti.commicrocontroller.ti.comwww.ti-rfid.comwww.ti.com/omap
www.ti.com/wirelessconnectivity
MailingAddress:TexasInstruments,PostOfficeBox655303,Dallas,Texas75265
Copyright©2012,TexasInstrumentsIncorporated
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www.ti.com/space-avionics-defensewww.ti.com/video
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