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专利名称：CONDUCTIVE FILM STRUCTURE AND
CONDUCTIVE FILM TYPE PROBE DEVICE FORICS
发明人：Min-Chieh CHOU,Tune-Hune KAO,Jen-Hui
TSAI
申请号：US13887091申请日：20130503
公开号：US20130241590A1公开日：20130919
专利附图：
摘要：A method for forming a conductive film structure is provided, which includes:
providing an insulating substrate having a surface; forming a plurality of trenches in thesurface of the insulating substrate, wherein the trenches are extended substantiallyparallel to each other; disposing the insulating substrate into a plating solution andplating conducting layers within the trenches to form a plurality of micro-wires; andstacking a plurality of the insulating substrates or winding or folding the insulatingsubstrate along an axis substantially parallel to an extended direction of the micro-wiresto form a conducting lump.
申请人：INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
地址：Hsinchu TW
国籍：TW
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