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专利名称：Resin composition and resin sheet发明人：奥野 真奈美,久保 有希申请号：JP2019063027申请日：20190328公开号：JP2020158739A公开日：20201001
摘要：PROBLEM TO BE SOLVED: To exhibit a higher moisture shielding property, and aresin suitable for forming a sealing portion of a light emitting element such as an organicEL element, an optical semiconductor such as a high-brightness LED, and a light receivingelement such as a solar cell. To provide the composition. SOLUTION: The followingcomponents (A) to (C): (A) Thermoplastic resin; A resin composition containing (B) ahygroscopic filler; and (C) a plate-like filler and having a water content of 1500 ppm orless. [Selection diagram] None
申请人：味の素株式会社
地址：東京都区京橋１丁目１５番１号
国籍：JP
代理人：高島 一,鎌田 光宜,土井 京子,田村 弥栄子,當麻 博文,赤井 厚子,戸崎 富哉
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